Better understand your needs
With years of experience in the industry and thousands of corporate services, we have a clearer understanding of customer needs
Implementation and execution
All product solutions are based on implementation and strong execution standards
Rich product line
We integrate business needs and user industry trends to find brand breakthroughs.
Customized service
Focus on high-end equipment and help customers solve technical problems in the industry
Core technology
Core Technology
Professional Team
A technical team composed of engineers and developers with many years of industry experience
Team members all have solid professional knowledge and rich practical experience
Design
Technology
Packaging Technology
Chip packaging not only protects the chip, but also realizes electrical connection and heat dissipation.
Packaging technology continues to evolve from advanced flip chip, wafer-level packaging, 2.5D/3D packaging, etc.
Hardware circuit design
Process technology is the core of chip manufacturing. Through processes such as etching and deposition, high-precision integrated circuits can be achieved.
Manufacturing Technology
Silicon is the main material for chip manufacturing, but in recent years, in order to meet higher performance requirements,
New materials continue to emerge, such as wide bandgap semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN).
Efficient energy management system
Efficient energy management system
Intelligent driving assistance function
Intelligent driver assistance system
Lightweight body design
Lightweight body design
About us
Core-based
Intelligently Connected Future
Based on the core, intelligently connecting the future
Xinchuang Zhilian adheres to the corporate philosophy of "taking chips as the foundation and intelligently connecting the future", deeply cultivates the field of chip research and development, and is committed to breaking industry barriers and promoting scientific and technological progress through cutting-edge technologies. The company has brought together a research and development team of 100 people composed of top chip experts and senior engineers at home and abroad, of which 30% have doctoral degrees. The core members have more than 10 years of industry experience and have profound attainments in integrated circuit design, chip architecture optimization and other fields.
12 Year
Deeply cultivate industry
180 item
Core Technology
24 h
Ultra-fast response
260 +
Top Talent
Core technology
Core Technology
Design Technology
Integrated circuit design is the basis of chip research and development, covering system architecture design, logic design, circuit design, etc. With the help of electronic design automation (EDA) tools, complex functional requirements are converted into chip layout.
Packaging Technology
Chip packaging not only protects the chip, but also enables electrical connection and heat dissipation. From traditional wire bonding packaging to advanced flip chip, wafer level packaging, 2.5D/3D packaging, etc., packaging technology continues to evolve.
Manufacturing Technology
The manufacturing process is the core of chip manufacturing. Through processes such as lithography, etching, and deposition, nanoscale transistors and circuits are built on silicon wafers.
Material Technology
Silicon is the main material for chip manufacturing, but in recent years, in order to meet higher performance requirements, new materials have emerged, such as wide bandgap semiconductor materials such as silicon carbide (SiC) and gallium nitride (GaN).
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